MEMS后封装技术  

MEMS Post Packaging

作　　者：杨建生[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子与封装》2011年第7期2-8,共7页Electronics & Packaging

摘　　要：通过对局部加热与压焊技术的研讨,介绍了微系统后封装技术,微系统封装技术在微电机系统(MEMS)蓬勃兴起的领域已成为主要的研究课题。构建多应用后封装工艺不仅推动了此领域的发展,而且加速了产品的商业化进程。文章概述了通过局部加热和压焊技术形成创新型后封装的方法,阐明了目前MEMS封装技术和晶片压焊工艺技术的工程基础。重点陈述了通过选择性密封工艺过程,包括集成低压力化学汽相淀积(LPCVD)密封工艺、局部硅-玻璃熔融压焊、局部焊料压焊和局部CVD(化学汽相淀积)压焊工艺过程。This work addresses important post-packaging issues for Microsystems and recommemds specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging field of microelectromechanical systems （MEMS）. Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging approach by localized heating and bonding. Process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition （LPCVD） sealing process. Localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding process.

关 键 词：化学汽相淀积压焊 低共熔压焊 融合压焊 MEMS封装 焊料压焊 

分 类 号：TN305.94[电子电信—物理电子学]