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作 者:甘小伟[1] 刘玉岭[1] 何彦刚[2] 李伟娟[1] 王娟[1] 宋洵奕[3]
机构地区:[1]河北工业大学微电子技术研究所,天津300130 [2]河北工业大学化工学院,天津300130 [3]河北工业大学信息工程学院,天津300130
出 处:《微纳电子技术》2011年第10期669-673,共5页Micronanoelectronic Technology
基 金:国家中长期发展规划重大专项项目(2009ZX02308)
摘 要:采用离子交换法去除ULSI/GLSI CMP浆料SiO2水溶胶中的Na+。介绍了微电子专用CMP SiO2水溶胶纯化的研究现状。实验分析了SiO2水溶胶中Na+与阳离子树脂的交换机理,硅溶胶中Na+去除分为硅溶胶溶液中Na+的去除和被硅溶胶胶团吸附Na+的去除。在交换动态平衡时,动态交换1 h较静态交换24 h生产效率提高了20多倍。同时阳1-阳1、阳2-阳1、阳3-阳1、阳1-阴1-阳1等离子交换工艺均能得到很好的纯化效果CNa+<5×10-6,不仅循环利用了树脂,而且酸碱耗量减少了50%以上。同时纯化硅溶胶配成碱性抛光液在硅片CMP应用中取得良好的结果。The Na^+ of the SiO2 hydrosol in the ULSI/GLSI CMP slurry was removed by ion exchange method. The research status of the purification for the microelectronics special CMP SiOz hydrosol was introduced. The exchange mechanism of Na^+ with cationic resins was analyzed, and there were two steps to remove Na^+ from the SiO2 hydrosol, i.e. the one was to remove Na^+ in the colloidal silica solution and the other was to remove Na^+ adsorbed by the silica sol. When the exchange reaches dynamic balance, the dynamic exchange for 1 h improves more than 20 times of the production efficiency compared with the static exchange for 24 h. Meanwhile, cationic onecationic one, cationic two-cationic one, cationic three-cationic one, cationic one-anion one-cationic one and so on the resin exchange processes all can get very good purification results of CNa^+ 〈5 × 10^-6 , in addition recycling the resin and reducing acid-alkali solution volume more than 50%. At the same time, the purified silica sol is exchanged to the alkaline slurry and a good result is got in the application of the silicon CMP process.
关 键 词:化学机械平坦化技术(CMP) 浆料 纯化 离子交换 NA^+
分 类 号:TN305.97[电子电信—物理电子学]
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