微系统三维(3D)封装技术  

3D Packaging for Microsystems

作　　者：杨建生[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子与封装》2011年第10期1-6,共6页Electronics & Packaging

摘　　要：文章论述塑料三维(3D)结构微系统封装技术相关问题,描述了把微电机硅膜泵与3D塑料密封垂直多芯片模块封装(MCM-V)相结合的微系统集成化。采用有限元技术分析封装结构中的封装应力,根据有限元设计研究结果,改变芯片载体结构,降低其发生裂纹的危险。计划采用板上芯片和塑料无引线芯片载体的替代低应力和低成本的3D封装技术方案。Issues associated with the packaging of microsystems in plastic and three-dimensional （3D） body styles are discussed. The integration of a microsystem incorporating a micromachined silicon membrane pump into a 3D plastic encapsulated vertical multichip module package （MCM-V） is described. Finite element techniques are used to analyze the encapsulation stress in the structure of the package. Cracks develop in the chip carrier due to thermornechanical stress. Based on the results of a finite element design study, the structures of the chip carriers are modified to reduce their risk of cracking. Alternative low stress 3D packaging methodologies based on chip on board and plastic leadless chip carriers are discussed.

关 键 词：有限元 微系统 封装技术 塑料无引线芯片载体 热机械应力 三维 

分 类 号：TN305.94[电子电信—物理电子学]