倒装陶瓷球栅阵列电子封装的热模型研究  

Investigation on thermal models of flip clip ceramic ball grid array electronic package

作　　者：谢秀娟[1] 杨少柒[1,2] 罗成[3] 周立华[1,2] 

机构地区：[1]中国科学院理化技术研究所低温工程学重点实验室,北京100190 [2]中国科学院研究生院,北京100049 [3]中国航空综合技术研究所,北京100028

出　　处：《电子元件与材料》2011年第11期68-71,共4页Electronic Components And Materials

基　　金：航空科学基金资助项目(No.20090246001)

摘　　要：针对倒装陶瓷球栅阵列（flip chip ceramic ball gridarray，FC-CBGA）封装，采用有限元数值方法，建立三维有限元的详细热模型。在5w热负荷下，分析裸芯式、平板式和盖板式三种形式，不同芯片尺寸（5min×5mm、15mm×15mm和20mm×20mm）以及不同润滑剂材料对系统热阻的影响。结果表明：采用盖板式能使芯片结点温度降低约10℃；芯片增大能使热阻降低88％～93％，改变导热润滑剂的材料热阻降低67％～80％。该模型结果与FLOPACK结果对比，误差在8％以内。3-D detailed model of FC-CBGA was set up by finite element method. Three types of bare die, lidded and metal cap FC-CBGA, different sizes of 5 mm×5 mm, 15 mm×15 mm and 20 mm×20 mm and different material of lubricant influencing on thermal resistance were analyzed in detail. The results show that the joint temperatures between solder balls of die and package shell can be decreased 10℃ effectively by using metal cap, the thermal resistance reduces 88%-93% by using larger size of dies and 67%-80% by changing different materials of lubricant, respectively. The discrepancy is lower than 8% by comparing with FLOPACK result.

关 键 词：倒装陶瓷球栅阵列 电子封装 热模型 

分 类 号：TN602[电子电信—电路与系统]