全金属化耦合封装的大功率半导体激光器模块  

Fully-Metalized Coupled-Packaged High-Power Semiconductor Laser Module

作　　者：郭洪[1] 杨璠[1] 孙迎波[1] 

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2011年第5期625-628,共4页Semiconductor Optoelectronics

摘　　要：大功率半导体激光器模块对耦合封装工艺要求较高,耦合封装工艺直接影响模块的可靠性。采用金属化楔形微透镜光纤与大功率半导体激光器对准耦合,耦合效率达到87%;采用激光焊接定位的方式对大功率半导体激光器与楔形微透镜光纤进行耦合固定,实现了大功率半导体激光器模块的全金属化封装。通过环境考核试验证明,模块储存温度达到-60～120℃,能够满足许多特殊环境对半导体激光器模块的要求。High-power semiconductor laser modules make high requirements on the coupled package process,as it directly affects the reliability of the laser modules.In this paper,metalized wedge-shaped lensed fibre is alignedly coupled into the high-power semiconductor laser,which can increase the coupled efficiency to be 87%.The method of laser welded orientation is applied to couple high-power semiconductor lasers with the wedge-shaped lensed fiber,and consequently the fully-metallized package is realized.The environmental tests prove that the storage temperature of the modules reaches-60~120 ℃,which can meet the requirement of special environments for semiconductor laser modules.

关 键 词：金属化耦合封装 半导体激光器 楔形微透镜光纤 耦合 

分 类 号：TN248.4[电子电信—物理电子学]