基于LTCC的微通道散热设计  

Design of micro-channel heat sink based on LTCC

作　　者：岳帅旗[1] 刘志辉[1] 徐洋[1] 张刚[1] 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子元件与材料》2011年第12期45-47,共3页Electronic Components And Materials

摘　　要：设计了基于LTCC(低温共烧陶瓷)的微通道散热模型,运用ANSYS软件对其进行了热-流耦合仿真分析,并制作了试验样件。测试结果显示,在环境温度25℃、冷却水入口水温25℃、入口流量27 mL/min、热源功率30 W的工况下,系统平衡时的最高温度为79.3℃,与仿真结果的85.7℃较为吻合,等效散热通量达到120 W/cm2。The model of the micro-channel heat sink based on LTCC （low temperature co-fired ceramics） was designed. Heat-liquid coupling effect was simulated and analyzed by ANSYS software and the sample for test was fabricated. Testing results show that under the condition of 25 ℃ of environment temperature, 25 ℃ of water inlet temperature, 27 mL/min of inlet water flux and 30 W of the heat resource, the highest temperature of static system is 79.3 ℃, which is approaching to the simulation result of 85.7 ℃, and the equivalent heat sink flux is 120 W/cm2.

关 键 词：低温共烧陶瓷 微通道 散热 ANSYS 

分 类 号：TM28[一般工业技术—材料科学与工程]