工作气压对磁控溅射Mo膜的影响  

Effects of Work Pressure on Mo Films Deposited by DC Magnetron Sputtering

作　　者：廖国[1,2] 王冰[1] 张玲[2] 牛忠彩[1] 张志娇[2] 何智兵[1] 杨晓峰[2] 李俊[1] 许华[1] 陈太红[2] 曾体贤[2] 谌家军[2] 

机构地区：[1]中国工程物理研究院激光聚变研究中心,绵阳621900 [2]西华师范大学物理与电子信息学院,南充637002

出　　处：《表面技术》2011年第6期82-84,93,共4页Surface Technology

基　　金：西华师范大学大学生科技创新基金项目(42710071)

摘　　要：采用直流磁控溅射沉积技术在不同工作气压下制备Mo膜,研究了工作气压对Mo膜的沉积速率、表面形貌及晶型结构的影响规律,研究表明:工作气压在0.1～0.5Pa范围内,沉积速率基本保持不变,在0.5～1.5Pa范围内沉积速率随工作气压的升高而增大;Mo膜的表面粗糙度随工作气压的升高而增加;不同工作气压下制备的Mo膜为立方结构,在较低工作气压下薄膜结晶性能较好。Mo films were fabricated at different sputtering pressure by DC magnetron sputtering. Deposition rate, surface topography and crystal structure of Mo films as the function of work pressure were studied. The results show that, in the pressure range of 0.1 Pa-0.5 Pa, the deposition rate has little changes, while in the pressurerange of 0.5 Pa-1. 5 Pa, the deposition rate increases with increasing the sputtering pressure. The surface roughness of Mo films in crease with increasing the sputtering pressure. All the Mo films are cubic structure. At lower sputtering pressure, the crystal of Mo film becomes good.

关 键 词：直流磁控溅射 MO薄膜 工作气压 沉积速率 表面形貌 

分 类 号：TG174.444[金属学及工艺—金属表面处理] O484[金属学及工艺—金属学]