超声波协助处理制备淀粉-肉桂醛包合物研究  

Preparation of the starch-cinnamaldehyde inclusion complex by the ultrasound technology

作　　者：朱艳巧[1] 田耀旗[1] 徐学明[1] 王庆玲[1] 金征宇[1] 

机构地区：[1]江南大学食品科学与技术国家重点实验室,江南大学食品学院,江苏无锡214122

出　　处：《食品工业科技》2012年第2期232-235,共4页Science and Technology of Food Industry

基　　金：国家自然科学基金(20976070,31071490)

摘　　要：基于超声波处理提高淀粉分子乳化性的原理,制备高直链玉米淀粉-肉桂醛包合物,并对超声处理时间、包埋温度、包埋时间、主客比对该包合物包埋率的影响进行了研究。结果表明高直链玉米淀粉-肉桂醛包合物的最佳包合条件为:超声处理时间10min,包埋温度35℃,包埋时间12h,主客比10:1(g/mL)。红外光谱实验表明高直链玉米淀粉-肉桂醛包合物已形成。在最佳包埋条件下,高直链玉米淀粉-肉桂醛包合物的包埋率可达到39.54%。High amylose corn starch-cinnamaldehyde inclusion complex was prepared, based on the improved emulsibility by the ultrasound technology. Effects of ultrasound time, encapsulation temperature and time, the ratio of host to guest on the encapsulation rate were also investigated.The results obtained that under the optimum conditions were addressed as follows, the ultrasound time was 10min, the encapsulation temperature and time were 35℃ and 12h,and the ratio of host to guest was 10：1 （g/mL）. Results from FT-IR experiment verified the formation of high amylose corn starch-cinnamaldehyde inclusion complex. Under the optimized conditions, the encapsulation rate of the high amylose corn starch-cinnamaldehyde inclusion complex reached 39.54%.

关 键 词：超声波技术 淀粉-肉桂醛包合物 包埋率 

分 类 号：TS201.2[轻工技术与工程—食品科学]