高靶材利用率的新型磁控溅射器  

Development of Cylindrical Rotating Magnetrons with High Target Utilization Rate

作　　者：黄士勇[1] 曲凤钦[1] 苗晔[1] 孟兆坤[1] 

机构地区：[1]烟台大学物理系,烟台264005

出　　处：《真空科学与技术》2000年第2期123-125,共3页Vacuum Science and Technology

摘　　要：在现代大型薄膜连续生产线中 ,其生产效率主要受以下两因数的影响 :溅射器的沉积速率和靶材的使用周期。本实验研制了一种圆筒形靶材绕溅射器中心轴线匀速旋转 ,并且与溅射器之间用螺丝固定连接的新型磁控溅射器。论述了新型溅射器的结构与组成 ,并给出实验结果与结论。其具有靶材利用率高、使用周期长、换靶时间短等优点。同时在反应溅射时避免在靶面上的形成介质层 ,提高了溅射过程的稳定性。Deposition rate and target utilization periods have major impacts on industrial production of films by magnetron sputtering.We have successfully developed a new type of rotating magnetron,which considerably remove most of the technical limitations in thin films production on industrial scale by conventional magnetron sputtering.A cylindrical target,fixed to the magnetron with bolts and nuts,rotates around its axis.Many advantages of the rotating magnetron,including high target utilization rate,long target utilization period,rapid target replacement,high stability in film growth and no unwanted media layer formation on target surfaces,were discussed.

关 键 词：磁控溅射器 使用周期 薄膜生产 靶材利用率 

分 类 号：TB43[一般工业技术]