电子封装与焊接质量的超声显微检测技术  

Scanning Acoustic Microscopy Testing Technology for Electronic Package and Welding Quality

作　　者：刘中柱[1,2] 徐春广[1] 郭祥辉[1] 赵新玉[1] 杨柳[1] 

机构地区：[1]北京理工大学先进加工技术国防重点学科实验室,北京100081 [2]中北大学机械工程与自动化学院,太原030051

出　　处：《电子与封装》2012年第3期1-5,24,共6页Electronics & Packaging

基　　金：国家自然科学基金(50975028);高等学校学科创新引智计划项目资助(B08043)

摘　　要：电子封装内部缺陷的尺度微小,引脚焊接的间距也很小,传统检测方法很难对其进行检测。超声显微技术利用聚焦高频超声来进行检测,能对试样表面、亚表面及其内部一定深度内的细微结构进行显微成像,可用来检测电子封装和评估焊接质量。文章采用高速数据采集卡、高频超声聚焦换能器、宽频脉冲收发仪与高精度运动系统,研发了一套超声显微镜系统。该系统具有较高的精度,功能基本完善,造价相对低廉,能进行全时域波形采集与存储。实验结果表明该系统能检测出电子封装内的微细缺陷,可用来评估引脚的焊接质量。The size of defects in electronic package＇s is micro scale,also the space between welding pins is crowd,so that it difficult to inspect it with traditional testing method.Scanning acoustic microscopy（SAM）with high-frequency focused ultrasound can be used to get deep insight on the micro structure.In this paper,an complete SAM system has been developed including a high-speed data acquisition card,high-frequency ultrasonic focus transducers,a broad band pulse transmitter/receiver,and a high-precision motion system.so this SAM system has some features like high accuracy,high-performance and low cost.Also several advanced non-destructive techniques are accomplished such as full-wave sampling,storing,and dynamical imaging.The inspection results on electronic packages proved that this SAM system can be a useful tool to find electronic package＇s inner micro defects and evaluate the welding quality of the pins.

关 键 词：超声显微镜 全波采集 电子封装 无损检测 

分 类 号：TB517[理学—物理]