微小型一体化管壳气密封装技术  

Hermetic Packaging for Micro Integral Substrate/Package

作　　者：胡骏[1] 雷党刚[1] 金家富[1] 付娟 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230031

出　　处：《电子与封装》2012年第4期1-3,19,共4页Electronics & Packaging

摘　　要：微小型一体化管壳将基板和外壳构成一个封装整体,可以较好地解决高密度集成微电路的封装难题。平行缝焊技术是微小型一体化管壳气密封装的主要形式,平行缝焊的热应力是造成微小型一体化管壳气密封装失效的主要原因。文章用有限元法计算了微小型一体化管壳的热应力分布,并在此基础上优化了平行缝焊参数,保证获得最佳的焊接效果。The micro integral substrate/package integrated the substrate with the package,which can solve the package problem for the high density and high integration microcircuit.The Parallel seam sealing was a method that we sealed the micro integral substrate/package.The stress of welding of the micro integral substrate/package mainly affected the reliability of the package.The stress of the package was calculated by the finite element method.On this basis,we optimized the parameters of the parallel seam sealing,so we can achieve the best effect of the parallel sealing.

关 键 词：一体化管壳 平行缝焊 焊接应力 有限元法 

分 类 号：TN305.94[电子电信—物理电子学]