圆片级真空封装技术在MEMS陀螺中的应用  

Application of Wafer-Level Vacuum Packaging Technology for MEMS Gyroscopes

作　　者：杨静[1] 张富强[1] 

机构地区：[1]北京微电子技术研究所,北京100076

出　　处：《微纳电子技术》2012年第5期345-349,共5页Micronanoelectronic Technology

摘　　要：为维持MEMS硅微陀螺的真空度,利用两次硅-玻璃阳极键合和真空长期维持技术,实现了MEMS硅微陀螺的圆片级真空气密性封装。制作过程包括:先将硅和玻璃键合,在硅-玻璃衬底上采用DRIE工艺刻蚀出硅振动结构;再利用MEMS圆片级阳极键合工艺在10-5 mbar(1 mbar=100 Pa)真空环境中进行封装;最后利用吸气剂实现圆片的长期真空气密性。经测试,采用这种方式制作出的硅微陀螺键合界面均匀平整无气泡,漏率低于5.0×10-8 atm.cm3/s。对芯片进行陶瓷封装,静态下测试得出品质因数超过12 000,并对样品进行连续一年监测,性能稳定无变化。In order to maintain the vacuum required for MEMS silicon micro gyroscopes,the wafer-level vacuum hermetic packaging of MEMS silicon micro gyroscopes was realized using the si-licon-glass anodic bonding for two times and long-term vacuum maintenance technology.The manufactu-ring process consists of bonding the silicon and glass,etching the silicon vibration structure on the silicon-glass base by DRIE,packaging in a vacuum environment of 10-5 mbar（1 mbar=100 Pa） by MEMS wafer-level anodic bonding and achieving long-term vacuum by using getters.The test results show that the fabricated silicon micro gyroscope has the smooth anodic bonding interface without any bubble,and the leakage rate is lower than 5.0×10-8 atm·cm3/s.After the ceramic packaging for chips,the measured quality factor is higher than 12 000 under the static condition.And the performance is stable without change after the continuous monitoring for one year.

关 键 词：MEMS硅微陀螺 圆片级封装 真空封装 阳极键合 品质因数 

分 类 号：TH703[机械工程—仪器科学与技术] TN305.94[机械工程—精密仪器及机械]