电子封装中的焊点及其可靠性  

Solder joint in electronic packages and its reliability

作　　者：王谦[1] Shi-WeiRickyLEE 汪刚强[1] 耿志挺[1] 黄乐[1] 唐祥云[1] 马莒生[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084 [2]香港科技大学机械工程系

出　　处：《电子元件与材料》2000年第2期24-26,共3页Electronic Components And Materials

摘　　要：在电子封装中 ,焊点失效将导致器件乃至整个系统失效 ,焊点失效的起因是焊点中热循环引起的裂纹及其扩展。从焊点的微观组织及其变化、焊点失效分析、焊点可靠性预测等方面介绍了对电子封装焊点及其可靠性研究的状况。ELECTRONIC COMPONENTS & MATERIALS (China), Vol 19, No 2, P 24 26 (Apr 2000) In Chinese Failure of a single solder joint in an electronic package may cause the overall failure of the device, even the whole system Failures of solder joints usually result from the growth of creep/fatigue crack under thermal cycling The research of solder joints and its reliability is introduced, with respects of solder joint microstructure, failure analysis, reliability forecast, etc (12 refs )

关 键 词：电子封装 焊点 可靠性 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]