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出 处:《微电子学》2012年第3期415-419,共5页Microelectronics
基 金:国家自然科学基金资助项目(11074280);中央高校基本科研业务费专项资金资助项目(JUSRP20914;JUDCF10031)
摘 要:利用准二维方法求解二维泊松方程,建立了锗硅源漏单轴应变PMOS阈值电压的二维解析模型,理论计算结果和实验报道的结果能很好吻合。研究了不同沟道长度和漏压情况下的沟道表面势,分析了沟道长度、漏压及锗硅源漏中锗摩尔组分等参数对阈值电压的影响。利用TCAD工具进行仿真模拟,结果表明,沟道长度和漏压是单轴应变PMOS阈值电压漂移的主要影响因素,而锗摩尔组分在一定成分范围内影响较小。An analytical two-dimensional (2-D) threshold voltage model for uniaxially strained PMOS with SiGe source/drain (S/D) structure was established by solving 2-D Poisson^s equation using quasi-2-D method. Theoreti- cal calculation results were in good agreement with the reported experimental data. Channel surface potentials at dif- ferent channel lengths and drain voltages were investigated, and effects of channel length, drain voltage and germa- nium molar fraction of SiGe S/D on threshold voltage were analyzed. Simulation using TCAD tools indicated that the channel length and drain voltage were major factors for threshold voltage drift, while in a certain composition range, the molar fraction of Ge showed relatively smaller effect on threshold voltage of uniaxially strained PMOS tran sistors.
关 键 词:PMOS 应变 锗硅源漏 阈值电压 二维解析模型
分 类 号:TN386.1[电子电信—物理电子学]
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