AuSn合金在电子封装中的应用及研究进展  

Application of AuSn Alloy in Electronic Package and Its Research Progress

作　　者：李金龙[1] 谈侃侃[1] 张志红[1] 胡琼[1] 罗俊[1,2] 李双江[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060 [2]西安电子科技大学微电子学院,西安710071

出　　处：《微电子学》2012年第4期539-546,共8页Microelectronics

摘　　要：AuSn合金焊料因其具有优良的抗腐蚀、抗疲劳特性和高强度、高可靠性等优点而在气密性封装、射频和微波封装、发光二极管(LED)、倒装芯片(Flip-chip)、激光二极管(LD)、芯片尺寸封装(CSP)等方面得到广泛的应用。从电子封装无铅化和合金焊料的可靠性等方面,对AuSn合金焊料的物相结构和材料性能进行了讨论,并对AuSn合金焊料在电子封装中的应用及其研究进展进行了总结和展望。Having advantages of corrosion resistance, anti-fatigue, high strength and high reliability, AuSn alloy solder has found wide application in hermetic packaging, RF and microwave packaging, LED, flip-chip packaging, laser diode （LD） and chip size package （CSP）. Phase structure and material properties of AuSn alloy solder were summarized and discussed, in terms of leadless electronic packaging and reliability of alloy solders. Application of AuSn alloy solder to electronic packaging and its research progress were reviewed.

关 键 词：AuSn 合金焊料 电子封装 

分 类 号：TN305.94[电子电信—物理电子学]