MEMS器件封装技术  

MEMS Devices Packaging Technology

作　　者：袁永举[1] 王静 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024 [2]无锡华测电子系统有限公司,江苏无锡214000

出　　处：《电子工业专用设备》2012年第7期6-8,18,共4页Equipment for Electronic Products Manufacturing

摘　　要：综述了微电子机械系统(MEMS)封装主流技术,包括芯片级封装、器件级封装和系统及封装技术进行了。重点介绍了圆片级键合、倒装焊等封装技术。并对MEMS封装的技术瓶颈进行了分析。The technologies of MEMS packaging are introduced, including three promising technologies： Wafer Level Packaging, Device Level, System Level Packaging. And the emphasis about using wafer level bonding, flip chip bonding technology. Then several reliability issues in MEMS packaging are pointed out, and a forecast is given for its future trends.

关 键 词：微电子机械系统 芯片级封装 倒装焊 

分 类 号：TN305[电子电信—物理电子学]