载药金属微针的结构设计及制备  

Design and Fabrication of Drug-Loaded Metal Microneedle

作　　者：曹玉田[1] 朱军[1] 曹莹[1] 李以贵[1] 陈翔[1] 陈迪[1] 

机构地区：[1]上海交通大学微纳科学技术研究院,微米纳米加工技术国防科技重点实验室,薄膜与微细技术教育部重点实验室,上海200030

出　　处：《上海交通大学学报》2012年第9期1428-1430,1435,共4页Journal of Shanghai Jiaotong University

基　　金：国家自然科学基金项目(50775149,60976081);教育部高等学校科技创新工程重大培育项目资助(708037)

摘　　要：提出一种新型载药微针结构设计方案,采用硅的各向异性刻蚀工艺与SU-8胶光刻工艺相结合的方法制备硅与光刻胶复合载药微针模具,将硅的各向异性刻蚀所得棱锥结构用于复制微针的尖端部分,SU-8胶曝光套刻出的带凸起结构的柱体用于复制微针的柱体部分,以此微结构为模具,通过2次聚二甲基硅氧烷(PDMS)浇铸复制而得PDMS凹三维结构.在此结构上,溅射金属种子层后采用小电流电铸技术电镀金属Ni,脱模得到载药金属微针.经力学性能测试,其断裂强度为366MPa,远大于刺穿皮肤所需断裂强度3.183MPa.A novel structure design of coating out of-plane microneedle was presented. With the combined adoption of anisotropic etching of silicon and photolithography of SU-8 photoresist, the mould of coating microneedle was prepared. The PDMS positive and negative structure was made by PDMS casting. Ni mi croneedle was prepared on the base of PDMS negative structure with low electric current electroforming. The fracture strength of the Ni mieroneedle is 366 MPa which is far higher than 3. 183 MPa,the required insertion pressure of human skin. The design improves the drug-loaded ability of the microneedle.

关 键 词：微针 光刻胶 各向异性刻蚀 断裂强度 

分 类 号：TN302[电子电信—物理电子学]