电极对平行缝焊的影响  

The Influence of the Electrode on the Parallel Seam Welding

作　　者：肖清惠[1] 杨娟[1] 赵洋立[1] 侯正军[1] 

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《电子与封装》2012年第9期6-9,共4页Electronics & Packaging

摘　　要：平行缝焊作为电子元器件的主要封盖方式之一,普遍用于对水汽含量和气密性要求较高的集成电路封装中。影响平行缝焊的因素很多,如夹具的设计、盖板与管座的匹配、电极表面的状态、工艺参数的设置等。文章通过在SSEC(Solid State Equipment Company)M-2300型平行缝焊机上进行实验,分别从电极的材料、电极的角度、电极表面的光洁度和电极的位置等方面总结出电极的状态对平行缝焊成品率的影响,并提出有效的改进方法。As one of the main in integrated circuit packaging many influence factors for the the condition of the electrode electronic components package forms, parallel seam welding is usually used which for the vapor content and air tightness requires rather high. There are parallel seam welding, such as fixture design, the match of cover and base, surface and setting of process parameters. Through experiments using themachine of the parallel seam welding with the model of SSEC （Solid State Equipment Company） M-2300, this passage summarizes the state of the parallel seam welding electrode on yield effect and puts forward effective ways of improvement, separately from the electrode material, electrode angle, the electrode surface roughness and electrode position.

关 键 词：封装 平行缝焊 电极 

分 类 号：TN305.94[电子电信—物理电子学]