基于CMOS激光位移传感器的板厚测量系统  

Based on CMOS laser displacement sensor plate thickness measurement system

作　　者：雷霆[1] 秦东兴[1] 胡峰[1] 金伟[1] 

机构地区：[1]电子科技大学,四川成都611731

出　　处：《自动化与仪器仪表》2012年第5期144-145,共2页Automation & Instrumentation

摘　　要：为了提高板材厚度参数的测量效率和精度,本系统利用CMOS激光位移传感器,通过激光三角法实现板材厚度的测量,并利用MPC08运动控制卡控制交流伺服系统实现激光位移传感器的测量定位,同时计算机对采集数据进行分析处理、显示和存储。实验表明该系统运行稳定可靠,测量效率大幅提高。In order to improve the efficiency and precision of plate thickness measurement, the system uses CMOS laser displace- ment sensors, through laser triangulation method to realize plate thickness measurement, and the use of MPC08 motion conlrol card to control AC servo system of laser sensor measuring position, at the same time the computer to analyze the data processing, display and storage. Experiments show that the system runs stably and reliably, a substantial increase in efficiency measurement.

关 键 词：运动控制卡 板厚测量 激光三角法 非接触 CMOS 

分 类 号：TP211[自动化与计算机技术—检测技术与自动化装置]