热循环条件下通孔插装焊点失效分析  

Failure analysis of through-hole solder joints under thermal cycling

作　　者：朱琦[1] 刘娜[2] 肖慧[2] 李晓延[2] 

机构地区：[1]机械科学研究院哈尔滨焊接研究所,150028 [2]北京工业大学材料科学与工程学院,100124

出　　处：《焊接》2012年第12期38-42,75,共5页Welding & Joining

基　　金：国家自然科学基金(51275007);北京市自然科学基金(2112005)

摘　　要：通孔插装焊点是元器件与电路板接合最为常见的方式,以传统的通孔插装焊点为研究对象,按照IPC-9701标准设计热循环试验,在不同周期对焊点进行金相分析,对其失效行为及机理进行了研究,并测试了焊点的热疲劳寿命。同时采用有限元数值计算,应用基于蠕变应变的寿命模型,计算了焊点的热疲劳寿命。所得的试验结果与理论计算基本吻合。Pin-through-hole(PTH) connection is one of the most common types of connection between components and circuit board.Taking the traditional PTH solder joints as research object,thermal cycling tests were conducted according to IPC-9701 standard.Sampling and micro-structure analysis for the solder joints was conducted every hundreds of cycles during thermal cycling process.Based on this,the failure behavior and mechanism,as well as the thermal fatigue life of the solder joints were investigated.In addition,finite element analysis(FEA) was applied to calculate the thermal fatigue life of the PTH solder joints based on creep strain model.The results show that the solder joint lives calculated by FEA were agreed well with that of the experimental results.

关 键 词：通孔插装 热循环 有限元 

分 类 号：TG42[金属学及工艺—焊接]