电子封装无铅焊点界面金属间化合物性能研究综述  

Investigation review of the properties of intermetallic compounds in lead-free solder joint in electronic packaging

作　　者：朱永鑫[1] 李晓延[1] 肖慧[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《功能材料》2013年第4期457-462,共6页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(50871004);北京市自然科学基金资助项目(2112005)

摘　　要：金属间化合物(IMC)在电子封装连接的过程中起到重要的作用,它是封装焊点可靠连接的标志。然而,由于IMC硬脆的固有属性,过厚的IMC层使连接可靠性变差。因此,研究IMC的性能有着重要的意义。介绍了测定IMC性能的常用方法,总结了IMC的主要性能,包括硬度、弹性模量,屈服强度及热膨胀系数等。The intermetallic compound（IMC） play an important role in the electronic packaging,which is a sign of reliable bonding.Nevertheless,thicker IMC layers exert detrimental influence on the bonding reliability for its intrinsic brittleness.Hence,it is meaningful to probe the property of the IMC layers.In this study,technique for testing the IMC property were reviewed and some results were listed,which mainly consisted of the hardness,modulus,yield strength and coefficient of thermal expand,etc.

关 键 词：金属材料 电子封装 综述 金属间化合物 性能 

分 类 号：TG425.1[金属学及工艺—焊接]