热循环条件下SnAgCu钎料损伤行为的研究(英文)  

Damage Behavior of SnAgCu Solder under Thermal Cycling

作　　者：肖慧[1] 李晓延[1] 严永长[1] 刘娜[1] 史耀武[1] 

机构地区：[1]北京工业大学,北京100124

出　　处：《稀有金属材料与工程》2013年第2期221-226,共6页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(50871004);Beijing Natural Science Foundation(2112005); Beijing Nature Science Foundation(2082003)

摘　　要：电子封装焊点的热循环失效是焊点材料损伤逐步发展的结果,本工作旨在对SnAgCu钎料的热循环损伤失效行为进行研究。以连续损伤力学理论为基础,提出了一种适用于热循环条件下SnAgCu钎料蠕变-疲劳交互作用的损伤模型。据此,设计了热力循环实验和热循环实验用以标定损伤模型相关参量。自行设计了双金属剪切加载装置并结合温度循环实验,对SnAgCu钎料的热力耦合损伤行为进行了深入研究。以电阻变化率作为损伤变量,并在热循环的不同周次测量试样的损伤值从而验证损伤模型。结果表明:所提出的幂函数形式的损伤模型能较好的描述SnAgCu钎料的热循环损伤演变。最后,对热循环条件下SnAgCu钎料试样的微观组织演变进行了SEM分析,从而揭示其损伤演变机理。The failure of solder joints under thermal cycling is mainly as a result of progressive damage process of solder materials. The objective of this study was to investigate the damage behavior of SnAgCu solder under thermal cycling condition. A damage model was proposed and employed to simulate the thermal cycling behavior of SnAgCu solder. The proposed damage evolution law was based on continuum damage mechanics and an interaction between creep and fatigue. Thermo-mechanical cycling and thermal cycling tests were conducted for model parameter determination. A special bimetallic load frame with single joint-shear solder sample was designed and used to study the damage evolution behavior of SnAgCu solder. The damage variable D=1–R0/R was selected and measured for the single joint-shear solder sample every dozens of cycles during thermal cycling tests to verify the model. The damage evolution law was deduced as power function with thermal cycles and the results show that the experimental damage data can be fitted reasonably well by the relationship as the damage model proposed. The microstructure evolution of SnAgCu solder under thermal cycling was observed by Scanning Electron Microscopy and the damage mechanism was analyzed.

关 键 词：蠕变-疲劳交互作用 连续损伤理论 SnAgCu钎料 热循环 

分 类 号：TG425[金属学及工艺—焊接]