运用研磨和化学机械抛光技术制备高品质的石英薄膜  

High-Quality Quartz Thin Film Prepared by Lapping and Chemical & Mechanical Polishing Technology

作　　者：曾毅波[1,2] 刘畅[1,2] 陈观生[1,2] 赵祖光[1,2] 郭航[1,2] 

机构地区：[1]厦门大学萨本栋微米纳米科学技术研究院,福建厦门361005 [2]厦门大学机电工程系,福建厦门361005

出　　处：《传感技术学报》2013年第1期1-6,共6页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金重点项目(60936003)

摘　　要：石英薄膜的质量是决定各种石英基底的微纳器件品质高低的关键所在。阐述如何运用研磨和化学机械抛光CMP(Chemical&Mechanical Polishing)技术获得高品质石英薄膜的方法。由于石英属于高硬度材料,选用金刚石研磨液和球墨铸铁研磨盘对石英衬底进行研磨,以获得较高的研磨速率和较好的研磨后的表面粗糙度。在石英CMP中,采用特殊的"两步抛"工艺,对衬底进行抛光。第一步粗抛抛光液采用金刚石颗粒直径为0.3μm的研磨液与SiO2颗粒直径为50 nm的抛光液相混合,第二步精抛只采用SiO2的抛光液。实验结果表明,采用上述技术,可以获得高品质的石英薄膜,厚度为(25.1±3.2)μm,表面粗糙度约为0.89 nm(RMS)。The quality of quartz thin film is a key to various kinds of quartz-based micro and nano devices. This paper presents techniques to gain high quality quartz thin film with lapping and chemical ＆ mechanical polishing （CMP）. Due to high hardness of quartz, diamond slurry and ductile iron plate are used for lapping the quartz substrate to get higher grinding rate and better roughness of the grinded surface. Fro CMP, a special procedure of ＂2-step-polishing＂ is developed,for which the first step is to use diamond slurry containing 0. 3 μm particles mixed with SiO2 slurry containing 50 nm particles, and the second step is to use only SiO2 slurry. Tested results show that a high quality quartz film, with thickness of（25.1 ±3.2 ） μm and roughness of 0.89 nm （ RMS）, is acquired by using the techniques presented in the paper.

关 键 词：微机电系统MEMS(Micro—Electro—Mechanical Systems) 石英薄膜 研磨 CMP 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]