微波集成电路技术—回顾与展望  

Microwave Integrated Circuit Technology—Retrospect and Prospect

作　　者：顾墨琳[1] 林守远[1] 

机构地区：[1]南京电子技术研究所,南京210013

出　　处：《微波学报》2000年第3期278-290,共13页Journal of Microwaves

摘　　要：半个多世纪来 ,微波电路技术经历了从分立电路、两维微波集成电路、三维微波集成电路等阶段。在回顾这一发展历程后 ,介绍多层微波集成电路和三维微波集成电路。阐述其产生背景、关键技术及发展方向。文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。瞻望二十一世纪前景。Over the past half century microwave circuits e volved from discrete circuits to planar integrated circuits, then to multilayer and three dimensional integrated circuits. After a brief review of the evolution process, multilayer microwave integrated circuits (including Mu-MMIC) and 3D m icrowave integrated circuits (including 3DMMIC) are introduced. The background, key technology and developments are illuminated. The concepts of 'micromachinin g' and Multi-Chip-Module (MCM) integrated from DC to RF components will be exp lained also. Finally, look forward to the prospects of microwave technique in th e 21 st century.

关 键 词：微波集成电路 微加工 多芯片模块 微波电路 

分 类 号：TN454[电子电信—微电子学与固体电子学]