细间距图形电路无氰化学镀金工艺研究  

Study of Cyanide-free Electroless Gold Plating for Patterned Circuits with Fine-pitch

作　　者：刘东光[1] 胡江华[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2013年第5期31-33,共3页Electronics & Packaging

基　　金：国防基础科研项目(A1120110020)

摘　　要：采用市售无氰化学金工艺在线宽/间距(50μm/50μm)精细图形电路表面化学镀金。镀层表面均匀一致,厚度可达2μm以上,无镀金层溢出现象。新的化学镀金工艺作为微带板可焊性表面处理技术之一,兼具可选择区域镀、可接触导通、良好的键合性能,能兼容各种助焊剂,对于细间距图形电路表面处理具有十分重要的意义。Commercial cyanide-free electroless Gold Plating technology used to deposit gold film on patterned circuits with fine-pitch （50 ~tm/50 ktm） ~ Investigated results indicated the thickness of gold film up to 2 tim, the film surface is smooth, and no gold coating spill over. New electroless gold plating progress as one of the weld surface treatment technology, can be used to selective area plating, has contact conductive, good bonding performance, and can compatible with various solder. This technology has the significance for the fine-pitch patterned circuits.

关 键 词：图形电路 化学镀金 细间距 表面 

分 类 号：TN305[电子电信—物理电子学]