金镀层中黑色杂质来源及产生机理分析  

Analysis on Sources and Formation Mechanism of Black Impurities in Gold Plating Layer

作　　者：胡玲[1] 贾莉莉[1] 徐东升[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2013年第1期47-49,共3页Hybrid Microelectronics Technology

摘　　要：为满足军用电子器件对封装外壳芯片焊接、引线键合、可焊性等的要求，外壳多采用镀金技术．但金镀层的质量尤其是纯度对键合及焊接可靠性至关重要。本文对生产中出现的金镀层黑色杂质的来源及产生的机理进行了分析，并通过扫描电镜（SEM）及能谱（EDS）手段对黑色杂质的形貌及成分进行了表征。结果表明：金镀层中黑色杂质来源于喷砂用橡胶手套。手套上脱落的橡胶附着在基材表面，形成镀层的黑色夹杂物。In order to satisfy the demands of the military electronics for chip welding, wire bonding and solderability of metal packaging, goht plating technology is mostly used in packaging case. But the quality,especially purity of gold plated layer is es- sential for bonding and welding reliability. This article analyzed the source and mechanism formation of black impurity in gold plating layer. Their morphology and elements are characterized by scanning electron microscope and energy dispersive spectrometer. Result shows that black impurity come from sand blasting rubber gloves. Rubber falling away from rubber gloves attached on the surface of base material and black impurities of gold plated layer are formed.

关 键 词：封装外壳 金镀层 黑色杂质 

分 类 号：TQ153.1[化学工程—电化学工业]