低银无铅焊料性能与可靠性研究进展  

Development of Properties and Reliability of Low-Ag Lead-free Solder Materials

作　　者：王强翔[1] 胡雅婷[1] 柴駪[1] 安兵[1] 吴懿平[1] 

机构地区：[1]华中科技大学材料科学与工程学院,湖北武汉430074

出　　处：《电子工艺技术》2013年第5期253-257,306,314,共7页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:60876070);高等学校博士学科点专项科研基金项目(项目编号:20090142120041)

摘　　要：概述了以SAC105、SAC0307为代表的低银无铅焊料在关键特性上与锡铅焊料(63Sn37Pb)以及高银无铅焊料(SAC305)的差异,对它们的组织成分、润湿性能、力学性能、抗跌落性能、温度循环和老化性能进行了比较分析。结果表明,低银无铅焊料与63Sn37Pb、SAC305的性能和可靠性近似,同时具有成本低、抗跌落性能高的优点,可望代替63Sn37Pb和SAC305。Review the key differences between Iow-Ag lead-free solder（SAC105,SAC0307） and traditional lead solder（63Sn37Pb） or high-Ag lead-free solder（SAC305）, focusing on their micro structures, wetting properties, mechanical properties, anti-drop performances, temperature cycling and thermal aging reliabilities. Find that the Iow.Ag lead-free solder show similar performance and reliability to traditional lead solder and high-Ag lead-free solder, while providing lower cost and better anti-drop performance advantages, and is expected to replace the 63Sn37Pb and SAC305 solder.

关 键 词：无铅焊料 低银 润湿性 力学性能 可靠性 

分 类 号：TN60[电子电信—电路与系统]