弱碱性多羟多胺抛光液稳定性  

Stability of the Weak Alkaline More Hydroxyl Amine Agent in the Slurry

作　　者：蔡婷[1] 刘玉岭[1] 王辰伟[1] 陈蕊[1] 高娇娇[1] 

机构地区：[1]河北工业大学微电子研究所,天津300130

出　　处：《微纳电子技术》2013年第12期785-788,共4页Micronanoelectronic Technology

基　　金：国家中长期发展规划重大科技专项资助项目(2009ZX02308)

摘　　要：稳定性是评估抛光液性能的重要指标之一,其关系到抛光液的寿命及能否产业化。从多羟多胺络合剂的反应原理出发,先对强碱性和弱碱性络合剂组成的抛光液进行对比。考量铜去除速率和抛光液的pH值,由这两方面随抛光液放置时间的变化规律对弱碱性多羟多胺组成的抛光液进行评估。实验结果表明,加入氧化剂后,强碱性络合剂配制的抛光液必须现配现用,否则铜去除速率和抛光液的pH值会快速下降;而弱碱性络合剂配制的抛光液在使用过程中放置时间可延长至8 h,且铜去除速率和抛光液的pH值稳定。The stability is an important index to assess the performance of the slurry, which is directly related to the lifetime and industrialization of the slurry. According to the reaction mecha- nism of the complexing agent of more hydroxyl amine, the slurries consisting of the strong alka- line and weak alkaline were compared. The copper removal rate and pH value of the slurry were investigated, and the variation regulation with the storage time was analyzed to assess the slurry consisting of the weak alkaline complexing agent. The exp＇erimental results show that after the addition of an oxidizing agent, the slurry with the strong complexing agent must be used as soon as it is mixed, otherwise the copper removal rate and pH value of the slurry will decrease rapidly. While the deposited time of the slurry with the weak alkaline complexing agent can be extended to 8 h, and the copper removal rate and pH value of the slurry are very stable.

关 键 词：稳定性 反应原理 络合剂 弱碱 抛光液 

分 类 号：TN305.2[电子电信—物理电子学]