高压蒸汽对塑封双极器件电参数的影响  

Effect of High-pressure Steam on Electric Parameters of Plastic Encapsulated Bipolar Devices

作　　者：韩兆芳[1] 梁琦[1] 黄峥嵘[1] 

机构地区：[1]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2013年第12期20-22,38,共4页Electronics & Packaging

摘　　要：塑封双极晶体管采用EIA/JESD22-A102-C规定的121℃、100%RH、29.7 psi压力的条件试验96 h后,测试发现直流增益HFE会有明显的下降,击穿电压BV CEO会略有上升。开封芯片检查和理论分析表明,高压水汽可以穿透封装,造成芯片内部微缺陷增加,导致器件HFE下降,BV CEO略有上升。通过优化封装材料及工艺,可以改善HFE漂移,增强器件抗潮湿性能。After the experimentation of 96 hours in the condition of 121 ℃, 100%RH and 29.7 psi pressure which prescribed in EIA/JESD22-A102-C, the HFE of plastic encapsulated bipolar devices will decrease obviously, and BFcEo will increase a little. It is approved by observation of die and theoretical analysis that High-pressure steam can penetrate through encapsulation and induce increase of micro-defects which can result in descending of HFE and increase of BVcEo. Optimizing of encapsulation process and materials can decrease shift of liFE and improve ability of anti-humidity.

关 键 词：塑封 双极器件 HFE 高压蒸汽 

分 类 号：TN322.8[电子电信—物理电子学]