印制电路板孔线共镀铜工艺研究  

Research on Copper Plating Process of Printed-Circuit Board Through Holes and Fine Lines with Simultaneous

作　　者：何杰[1] 何为[1] 陈苑明[1] 冯立[1] 徐缓 周华 郭茂桂 李志丹 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]博敏电子股份有限公司,广东梅州514000

出　　处：《电镀与精饰》2013年第12期27-30,43,共5页Plating & Finishing

基　　金：广东省教育部产学研结合项目(2012A090300007)

摘　　要：在印制电路板上应用孔线共镀法制作了板δ为1.5 mm、d为200μm的导通孔及线宽、线距均为50μm的精细线路。研究了图形转移、电镀过程控制对导通孔及精细线路制作质量的影响;对比分析了孔线共镀工艺与减成法工艺在孔线制作上的优劣。结果表明,图形转移中LDI系统图形对位精度高、干膜与覆铜板的结合效果好;控制CuSO4、H2SO4质量浓度分别为70g/L及190g/L,Jк为1.5A/dm2,t为80min及适当溶液搅拌条件下电镀,导通孔深镀能力达60%以上,精细线路与基板结合力强;孔线共镀法较减成法制作效率更高,线路侧蚀量较小。The holes with thickness at 1.5 mm and diameter at 200 μm hole and the fine lines with width and pitch both at 50 μm were manufactured through simultaneous electroplating.The influence of imaging transfer and electroplating process controlling on the quality of via holes and fine lines was studied.The via holes and fine lines with simultaneous electroplating and substractive process had been analyzed in this paper.The results indicates that the LDI system has high accuracy of alignment,and the combination of dry film and copperclad palte is good during imaging transferring.Make sure that the mass concentration of CuSO4 and H2SO4 are 70g/L and 190g/L respectively,the current density is 1.5 A/dm2,stirring at the suitable solvent conditions and electroplating for 80 μmin,the throwing power of the via holes is more than 60％.The simultaneous electroplating is more efficient than substractive process,and lateral erosion of fine lines is smaller.

关 键 词：孔线共镀 导通孔 精细线路 孔金属化 镀铜 

分 类 号：TN41[电子电信—微电子学与固体电子学] TQ153.14[化学工程—电化学工业]