铝合金封装中陶瓷基板的可靠性优化设计研究  

Reliability optimization of ceramic substrate in aluminum alloy package

作　　者：王合利[1] 徐达[1] 常青松[1] 王志会[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子元件与材料》2014年第3期73-76,共4页Electronic Components And Materials

摘　　要：在铝合金封装外壳中使用陶瓷基板时,由于热膨胀系数差异巨大,易产生较高热应力,甚至导致基板断裂。采用有限元分析与试验相结合的方法研究了如何从结构设计角度降低这类结构中陶瓷基板的热失配应力问题。研究结果表明,陶瓷基板应力是水平方向拘束导致的热应力和附加弯矩引起的弯曲应力叠加后共同作用的结果,且主要是后者作用的结果。结构设计时应遵循降低陶瓷基板/铝合金盒底厚度比的原则。当基板厚度一定时,应选用厚底铝合金封装外壳。当铝合金外壳底厚一定时,降低陶瓷基板厚度,则可靠性更高。When ceramic substrate is introduced in housing package with aluminum alloy, serious thermal expansion mismatch between ceramic and aluminum alloy is prone to result in high thermal stress and even ceramic substrate failure. With a combination of finite element analysis and experiments, the stress intensity and evolution in the package were studied in order to reduce the stress in ceramic substrate. Results indicate that the stress on ceramic substrate is caused by combination of thermal stress as a result of plane restraint and flexural stress as a result of additional moment. The thickness ratio of ceramic substrate to aluminum alloy package bottom should be decreased so as to reduce the stress on ceramic substrate. If the thickness of ceramic substrate is constant, the thicker package bottom should be employed. If the thickness of package bottom is constant, the structure with thiner ceramic substrate has higher reliability.

关 键 词：陶瓷基板 铝合金封装 热膨胀系数 应力 可靠性 有限元分析 

分 类 号：TG454[金属学及工艺—焊接]