ACF键合中导电粒子捕捉及变形的影响机理与实验  

Study on Mechanism and Experiment of the Capture and Deformation of Conductive Particles During ACF Bonding Process

作　　者：朱钦淼[1] 陶波[1] 徐仁骁 黄扬[1] 吴光华[1] 

机构地区：[1]华中科技大学数字制造装备与技术国家重点实验室,武汉430074

出　　处：《电子与封装》2014年第3期1-4,共4页Electronics & Packaging

基　　金：国家自然科学基金项目(50805060);国家重大专项课题(2012ZX04010-071)

摘　　要：ACF键合工艺下导电性能的提升需要对导电粒子捕捉与变形的影响机理进行深入了解。通过实验研究得到了不同键合工艺下导电粒子捕捉与变形规律,并对规律进行了理论分析。实验结果表明:随着键合压力增加,导电粒子捕捉数呈现出减少的趋势,导电粒子的变形呈现出增大的趋势。随着键合温度增加,导电粒子变形量呈现出先增大后减小的趋势,当键合温度达到230℃时,导电粒子捕捉数骤升。It needs deeply understand the mechanism of the capture and deformation of conductive particles to enhance the conductive properties during ACF bonding process. The paper presents the law of the capture and deformation of conductive particles under different process parameters through experiments and carries out the theoretical analysis. Experimental results show that with the bonding pressure increasing the number of conductive particles capture showing a decreasing trend, the deformation of the conductive particles showing an increasing trend, meanwhile, with the bonding temperature increasing the deformation of conductive particles showing a ifrst increasing and then decreasing trend, when the bonding temperature reached 230℃, the number of conductive particles capture rose rapidly.

关 键 词：键合工艺 粒子捕捉与变形 导电性能 

分 类 号：TN605[电子电信—电路与系统]