新型表面活性剂对低磨料铜化学机械抛光液性能的影响  

Effect of a novel surfactant on performance of chemical-mechanical polishing solution used for copper with low abrasive content

作　　者：李炎[1] 刘玉岭[1] 李洪波[1,2] 唐继英[1] 樊世燕[1] 闫辰奇[1] 张金[1] 

机构地区：[1]河北工业大学微电子研究所,天津300130 [2]河北联合大学信息工程学院,河北唐山063000

出　　处：《电镀与涂饰》2014年第8期325-329,363,共5页Electroplating & Finishing

基　　金：国家中长期科技发展规划02科技重大专项(2009ZX02308);河北省自然科学基金(E2013202247);河北省自然科学基金(F2012202094);河北省教育厅基金(2011128)

摘　　要：介绍了一种用于铜膜化学机械抛光的多元胺醇型非离子表面活性剂。研究了该表面活性剂对抛光液表面张力、黏度、粒径、抛光速率和抛光后铜的表面状态的影响。抛光液的基本组成和工艺条件为:SiO2 0.5%,H2O2 0.5%,FA/OII型螯合剂5%(以上均为体积分数),工作压力2 psi,抛头转速60 r/min,抛盘转速65 r/min,抛光液流量150 mL/min,抛光时间3 min,抛光温度21°C。结果表明,微量表面活性剂的加入能显著降低抛光液的表面张力并大幅提高抛光液的稳定性,但对静置24 h后抛光液黏度的影响不大。表面活性剂含量为0%～2%时,随其含量增大,化学机械抛光速率减小,抛光面的粗糙度降低。A kind of multiple amino alcohol nonionic surfactant applied to the chemical-mechanical polishing of copper film was introduced. The effect of the surfactant on the surface tension, viscosity, particle size, and polishing rate of polishing solution and the surface state of polished copper were studied. The basic composition of polishing solution and process parameters are as follows： SiO20.5vo1%, H202 0.5vo1%, FA/OII chelating agent 5vo1%, working press 2 psi, rotation rate of polishing head 60 r/min, rotation rate of polishing disc 65 r/min, flow rate of polishing solution 150 mL/min, polishing time 3 min, and polishing temperature 21℃. The results showed that the addition of a trace amount of surfactant can reduce the surface tension and improve the stability of polishing solution markedly, but has slight impact on the viscosity of polishing solution after storage for 24 h. The chemical-mechanical polishing rate as well as the roughness of polished surface are reduced with the increasing of surfactant content in the range of 0%-2%.

关 键 词：铜 化学机械抛光 非离子表面活性剂 表面张力 黏度 粒径 

分 类 号：TN43[电子电信—微电子学与固体电子学] TN47