LTCC基板腔底平整度研究  

Study on floor flatness of LTCC cavities

作　　者：岳帅旗[1] 刘志辉[1] 张刚[1] 徐洋[1] 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子元件与材料》2014年第5期80-84,共5页Electronic Components And Materials

摘　　要：从工艺过程和结构设计两个方面对LTCC（低温共烧陶瓷）基板腔底平整度进行了定量研究。结果显示，在10～30μm内，填充物与腔体的配合尺寸对腔底平整度影响不大，腔底的翘曲主要是由于通孔分布密度过大所造成的。对于直径为0．15mm的金属化通孔，孔心间距需达到0．42mm时才能够获得较好的腔底平整度。Floor flatness of LTCC （Low Temperature Co-fired Ceramic） cavity was analyzed quantificationally in aspects of the process and the design. Results show that, in the range of 10-30μm, matching magnitude between the filling object and the cavity has little impact on floor flatness. The main reason of cavity floor camber is the too large density of via distribution. For 0.15 mm diameter via, good flatness of cavity floor can be achieved while the center distance between vias is as far as 0.42 mm.

关 键 词：低温共烧陶瓷 LTCC腔底平整度 烧结应力 通孔 层压 填充物 

分 类 号：TN705[电子电信—电路与系统]