表贴式MMIC高密度封装外壳微波特性设计  

The Design of a Microwave Surface Mount MMIC High-density Package

作　　者：徐利[1] 曹坤[1] 李思其[1] 王子良[1,2] 

机构地区：[1]南京电子器件研究所,南京210016 [2]微波毫米波单片集成和模块电路重点实验室,南京210016

出　　处：《固体电子学研究与进展》2014年第2期152-156,196,共6页Research & Progress of SSE

摘　　要：基于高温共烧陶瓷(HTCC)工艺,研制了一款32根引脚方形扁平无引线封装(CQFN)型微波外壳,外形尺寸仅为5mm×5mm×1.4mm。该外壳采用侧面挂孔的方式实现微波信号从基板底部到外壳内部带状线和键合区微带线的传输,底部增加了密集阵列接地过孔以消除高密度引脚间的耦合。对制作的外壳进行了微波性能测试,在C波段内的插入损耗小于0.5dB,驻波比小于1.3,隔离度大于30dB。该小型化表贴陶瓷外壳适用于C波段的微波单片集成电路(MMIC)的高品质气密封装,且便于批量化生产。The CQFN microwave package with 32 pins has been fabricated based on HTCC technology. The package size is 5 mm × 5 mm × 1.4 mm only. The side plated semi-through hole was designed to achieve the signal transmission from bottom pad to the bonding line. And the intensive grounding via array was added in the package, which could eliminate the coupling between the pins effectively. Measurement results show that the insertion loss of the package with lid is less than 0.5 dB on C-band, the VSWR of the package is less than 1.3 and the isolation is more than 30 dB. The miniaturization surface mount ceramic package was designed for multi-function MMIC worked on C-band. This sealing package with good performance is suitable for mass manufacturing.

关 键 词：高温共烧陶瓷 方形扁平无引线封装 微波外壳 高密度封装 微波单片集成电路 

分 类 号：TN305[电子电信—物理电子学] TN454