时效对无铅焊料Ni-P/Cu焊点的影响  

EFFECT OF AGING ON THE MICROSTRUCTURE AND SHEAR STRENGTH OF LEAD FREE/Ni-P/Cu SOLDER JOINTS

作　　者：肖克来提[1] 杜黎光[1] 盛玫[1] 罗乐[1] 

机构地区：[1]中国科学院上海冶金研究所

出　　处：《材料研究学报》2001年第2期193-200,共8页Chinese Journal of Materials Research

摘　　要：研究了１５０℃等温时效对６２Ｓｎ３６Ｐｂ２Ａｇ／Ｎｉ－Ｐ／Ｃｕ及共晶ＳｎＡｇ／Ｎｉ－Ｐ／Ｃｕ表面贴装焊点微结构及剪切强度的影响．结果表明，在钎料与Ｎｉ－Ｐ间的界面存在Ｎｉ３Ｓｎ４金属间化合物层,其厚度随时效时间增加，Ｎｉ－Ｐ层的厚度减小；时效后，ＳｎＰｂＡｇ、ＳｎＡｇ焊点的剪切强度下降．对于ＳｎＡｇ焊点，时效２５０ｈ后其剪切强度剧烈下降，断裂发生在Ｎｉ－Ｐ／Ｃｕ界面上，在长时间时效后焊点一侧的Ｎｉ－Ｐ层中Ｐ的含量较高可能是Ｎｉ－Ｐ／Ｃｕ结合强度变差的主要原因．ＳｎＰｂＡｇ焊点保持着较高的剪切强度．The effect of aging on the microstructure and shear strength of 62Sn36Pb2Ag/Ni-P/Cu and SnAg/Ni-P/Cu surface mount solder joints was investigated. Intermetallic (IMC) layer of Ni3Sn4 was found in the interface between both solders and Ni-P layer and it thickens with aging time, meanwhile accompanied with a decrease of the thickness of remaining Ni-P layer. A drastic drop of the shear strength of SnAg solder joint happens after 250 h aging and fracture was found to occur at the interface between Ni-P layer and Cu substrate. This may possibly be caused by the rapid accumulation of P in the remaining Ni-P layer, which results in a poor adhesion between Ni-P and Cu substrate. On the other hand, SnPbAg solder joint keeps a relatively higher value of shear strength even though it decreases with aging time.

关 键 词：锡银焊点 钎焊 时效 微结构 剪切强度 无铅焊料 钎料 钎焊 锡铅银焊点 钎料/铜界面 

分 类 号：TG425[金属学及工艺—焊接] TG454