静电式微开关硅悬臂梁的变形分析  

Deformation analysis of silicon cantilever for electrostatic microswitch

作　　者：陈广文[1] 许高攀[1] 胡国清[1] 

机构地区：[1]厦门大学机电工程系,福建厦门361005

出　　处：《传感器技术》2001年第12期29-31,共3页Journal of Transducer Technology

摘　　要：介绍了一种计算微开关的硅悬臂梁在电场力作用下的变形的方法 ,由于作用在梁上的载荷随着梁的变形而变化 ,用积分法计算存在相当困难 ,以下提出了一种计算变形的新方法 :将梁分为m个小段 ,则梁上的分布力可近似为m个集中力 ,将初始均布载荷分成n步 ,逐步加载 ,在每个载荷步后根据变形结果修正m个集中力 ,同时增加一个载荷增量 ,作为下一步的载荷。只要m和n取到充分大 。The deformation analysis of a silicon micromachnied cantilever of electrostatic microswitch is presented.From analysis, it has been know that the force applied on the cantilever varies according to the deformation of cantilever,so it is difficult to solve the differential equation of the deformation,especially,the load is changing.A new method to solve this problem was presented as follow,the cantilever is divided into a number of small segment,it is assumption that every segment has a constant concentrated force,and the force of electricity is loaded step by step, when the segment and load step is small enough,the simulation result will be limited to accuracy.

关 键 词：硅悬臂梁 变形分析 增量法 微开关 MEMS 微加工 

分 类 号：TM564[电气工程—电器] TP212[自动化与计算机技术—检测技术与自动化装置]