双酚A苯并恶嗪-环氧树脂基印制电路基板的研究  

STUDY ON BISPHENOL A BENZOXAZINE-EPOXY RESIN PCB BASE PLATE

作　　者：王劲[1] 黄信泉[1] 谢美丽[1] 凌鸿[1] 盛兆碧[1] 顾宜[1] 

机构地区：[1]四川大学高分子科学与工程学院,成都610065

出　　处：《工程塑料应用》2002年第2期32-35,共4页Engineering Plastics Application

摘　　要：采用双酚A苯并恶嗪与环氧树脂共混改性制得胶液,经浸渍玻璃布、烘焙、压制得到了一系列玻璃布覆铜板基板。其中含溴型基板的玻璃化转变温度为145.2℃,加强耐热性在300 s以上,常温下表面电阻率和体积电阻率分别为1.51×10^(14)Ω、5.75×10^(14)Ω·m,无溴型基板玻璃化转变温度为160.3℃,加强耐热性在300 s以上,常温下表面电阻率和体积电阻率分别为1.91×10^(13)Ω、5.01×10^(14)Ω·m,覆铜板的耐浸焊性能优异,达到60 s以上。Bisphenol A benzoxazine-epoxy/glass cloth PCB baseplates were prepared. Brominated and bromine free epoxy resins were used. Heat resistance, mechanical and insulating behaviours of baseplates were measured. The results showed that, for 12# baseplate, Tg(TMA) was 145.2℃, heat-resistant time was above 300s at (288±2)℃,ρ(?) was 1.51×1014Ω ,ρ(?), was 5.75×1014Ω·m , flexural strength was 563.1 MPa . For 11# baseplate, Tg(TM A ) was 160.3℃, heat-resistant time was above 300s at (288±2)℃, ρ(?) was 1.91×1013Ω, ρ(?) was 5.01×1014Ω·m , flexural strength was 572.7MPa.

关 键 词：双酚A苯并恶嗪 耐热性 覆铜板 基板 环氧树脂基 印制电路 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TN704[电子电信—电路与系统]