LTCC窄间距3D—MCM垂直互连技术研究  

Research on LTCC Small Spacing 3D -MCM Vertical Interconnection

作　　者：戴端[1] 李建辉[1] 吴建利[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《混合微电子技术》2013年第3期29-33,共5页Hybrid Microelectronics Technology

摘　　要：LTCC窄间距3D—MCM是实现高密度组装的重要手段，与通常3D—MCM比较，焊接时易出现桥连和错位。制作焊料凸点和垂直互连是完成2D-MCM转化成3D-MCM的重要途径。本文介绍了LTCC窄间距3D-MCM的基本结构和工艺设计。通过焊球种类和大小的选择，控制助焊料用量，优化再流焊工艺参数，制作出了满足要求的焊料凸点；通过选择合适的多层互连工艺参数，实现了窄间距3D．MCM的垂直互连。LTCC small spacing 3D - MCM is an important method of realizing high density assembly, By comparing to common 3D -MCM,bridging and dislocation occur easily in soldering process. The fabrication of solder bump and the vertical interconnection are important methods to convert 2D -MCM into 3D - MCM. In this paper, the basic structure and process design of LTCC small spacing 3D - MCM is introduced. The qualifed solder bumps are produced through choosing dimensions and species of solder ball, controlling the amount of auxiliary solder and optimizing reflow soldering process parameters. The small spacing 3D - MCM vertical interconnection is realized by choosing appropriate parameters of multi - layer interconnection process.

关 键 词：窄间距 LTCC 3D—MCM 焊料凸点 垂直互连 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]