碳化硅材料在微电子机械系统中的应用  

Application of silicon carbide material in microelectromechanical system field

作　　者：刘肃[1] 唐莹[1] 李思渊[1] 

机构地区：[1]兰州大学物理科学与技术学院微电子中心,甘肃兰州730001

出　　处：《微纳电子技术》2002年第8期26-30,共5页Micronanoelectronic Technology

基　　金：教育部高等学校骨干教师资助计划资助;甘肃省自然科学基金(ZS001-A25-044-C)资助

摘　　要：碳化硅材料包括单晶碳化硅、多晶碳化硅、无定形碳化硅等,由于其显著的材料特性,如耐热、耐磨、化学惰性和高硬度等,近年来在微电子机械系统(MEMS)领域受到越来越多的关注。应用特定的工艺条件将碳化硅材料制成MEMS器件,可以在某些特殊条件下使用,克服了常规材料本身的局限性,从而为碳化硅材料的应用开发了新的领域。追踪这一国际热点研究问题,针对以上几种不同形态材料,分别举例说明了它们在MEMS领域应用的进展情况。Silicon carbide(SiC),including single crystal SiC,poly and amorphous SiC,is a promising material for microstructures used in harsh environments for its great characteristic such as heat resistance,wear resistance,chemical inertness and high hardness.Moreover,SiC material can play a important role in microelectromechanical systems .The SiC MEMS devices fabricated with special processing techniques can be used in such harsh environment and overcome the shortcoming which using conventional material and so,it appears to be an ideal material for MEMS application.Some examples of MEMS devices made in SiC MEMS technology are listed and progress in SiC applications have been reported.

关 键 词：碳化硅 微电子机械系统 微结构 MEMS 

分 类 号：TN304.24[电子电信—物理电子学]