用于系统级封装的毫米波介质填充波导的研究  

Research on millimeter-wave dielectric filled rectangular waveguide for system-in-package

作　　者：王启东[1,2] Daniel Guidotti 曹立强[1,2] 万里兮[1,2] 叶甜春[1,2] 

机构地区：[1]中国科学院微电子研究所,北京100029 [2]华进半导体封装先导技术研发中心有限公司,江苏无锡214135 [3]乔治亚理工大学

出　　处：《现代电子技术》2014年第21期83-86,共4页Modern Electronics Technique

基　　金：重大科学技术专项(2013ZX02502-004)

摘　　要：基于不断发展的系统级封装技术,提出了一种用于芯片间高速互连的新型可集成的物理器件:硅基毫米波介质填充波导。文中阐述了该器件的物理原理,采用建模、仿真相结合的方法对该模块进行了结构设计,利用新的设计思路结合半导体工艺解决了毫米波互连结构内部的反射、电压驻波比(VSWR)、信号耦合、准TEM-TE-准TEM转换传输问题以及毫米波互连结构阵列中信号泄露的问题,并利用半导体与MEMS加工工艺加以实现。测试结果表明宽度为680μm的单通道矩形波导,-10 d B带宽为9.8 GHz,相对带宽为12.56%;传输损耗为1 d B/cm,工作频带内相邻波导之间串扰低于-40 d B,可以形成大阵列并进行集成,从而实现芯片间数据的并行传输。With the boost of system-in-package（Si P）technology,a brand new physical component for chip-to-chip highspeed interconnection is proposed in this paper. The physical principle is described. The method to combine the modeling with simulation was used to design the structure of the module. In combination with the semiconductor technology,the new design method is utilized to solved the problems of reflection inside millimeter wave interconnection structure,VSWR（voltage standing wave ratio）,signal coupling,quasi TEM-TE-quasi TEM transition and signal leakage in millimeter wave interconnection structure array. The state-of-art planar semiconductor process and MEMS process are applied to the implementation of the component.The testing result indicates the single channel rectangular waveguide with width of 680 um has-10 d B bandwidth at 9.8 GHz,the relative bandwidth is 12.56%,transmission loss is 1d B/cm,and the crosstalk between adjacent channels is below-40 d B.The silicon filled rectangular waveguides are able to be integrated into big array to realize the high bandwidth parallel communication from chip to chip.

关 键 词：毫米波 介质填充波导 芯片间互连 系统级封装 

分 类 号：TN919-34[电子电信—通信与信息系统]