基于OLED器件的封装材料研究进展  

Research Progress of Encapsulation Materials for OLED

作　　者：张贾伟 张国平[1] 孙蓉[1] 李世玮[2] 汪正平[3] 

机构地区：[1]中国科学院深圳先进技术研究院,深圳518055 [2]香港中文大学,香港999077 [3]香港科技大学机械工程系,香港999077

出　　处：《集成技术》2014年第6期92-101,共10页Journal of Integration Technology

基　　金：国家自然科学基金(21201175);广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳市电子封装材料工程实验室(深发改【2012】372号)

摘　　要：有机电致发光器件(Organic Light-Emitting Diode,OLED)因其轻薄、视角广、响应时间短、发光效率高、成本低等优点成为公认的新一代显示技术。为减少甚至避免有机发光材料受到外界环境的侵蚀、保证OLED的使用寿命,OLED封装材料得到了大力的研究和发展。OLED封装材料必须具有优秀的水氧阻隔能力,此外,还要求有良好的热导率、透光率、机械强度、耐腐蚀性与基底的粘结性等性质。文章对OLED封装材料的发展作了详细的介绍,包括传统后盖式封装所用的金属、玻璃、陶瓷和薄膜封装所用的无机化合物、聚合物、复合材料。根据OLED器件的性能以及封装形式的需求,探讨了封装材料的未来发展方向。As a potential new generation display technology, OLED has many advantages such as light weight, wide visual angle, quick response, high luminous efifciency and low cost. The research and development of OLED encapsulation materials is to prevent corrosion by oxygen and moisture from the external environment and prolong the lifetime of organic emitting materials. Besides excellent barrier properties, OLED encapsulation materials also require good thermal conductivity, luminousness, mechanical strength, corrosion resistance and good adhesion to substrate and so on. In this paper, the development of OLED encapsulation materials was introduced in detail which cover the metal, glass and ceramic used for conventional encapsulation and inorganic compounds, polymers and composite materials used for the thin iflm encapsulation. The development direction of OLED encapsulation materials based on the demands of packaging methods in future was also discussed.

关 键 词：封装材料 阻隔性能 

分 类 号：TN312.8[电子电信—物理电子学]