基于聚二甲基硅氧烷的微流控芯片封装技术研究  

Research of Bonding Method of Microfluidic Chip Based on PDMS

作　　者：毛静[1] 张斌珍[1,2] 杨潞霞[1] 王春水[1] 南雪莉[1] 李惠琴[1] 

机构地区：[1]中北大学仪器科学与动态测试教育部重点实验室,太原030051 [2]中北大学电子测试技术重点实验室,太原030051

出　　处：《科学技术与工程》2015年第1期228-231,共4页Science Technology and Engineering

基　　金：国家自然基金(61176115)资助

摘　　要：提出一种优化的PDMS(聚二甲基硅氧烷)—PDMS键合技术,对PDMS基片与PDMS盖片使用不同的预聚物和固化剂配比进行键合。设置了按不同比例键合、氧气等离子体表面处理键合及涂覆液态PDMS键合这三种方法的对比实验,并将其应用于微流控芯片的封装测试。测试结果表明,不同比例键合后的芯片键合强度适宜,可重复利用,高效节能。键合参数:基片和盖片所用预聚体、固化剂质量比分别为10∶1和15∶1;盖片的固化温度75℃,固化时间40 min。A optimization of PDMS （polydimethylsiloxane）-PDMS bonding technology was proposed,PDMS substrate and cover plate has been bonded by adopting different ratio of prepolymers and curing agent.Three methods of contrast experiment has been set in this paper with different cross-linking ratios bonding,oxygen plasma treatment bonding and coating liquid PDMS bonding.Finally,they are applied to microfluidic chip encapsulation testing.The results show that,after natural bonding,chip has a appropriate strength,which are reusable,high-efficiency and energy saving.The bonding parameters are as follows：the mass ratio of prepolymers and curing agent used for PDMS substrate and cover sheet is 10∶1 and 15∶1 respectively.Curing temperature of cover plate is 75 ℃ and the curing time it cost is 40 min.

关 键 词：聚二甲基硅氧烷 微流控芯片 封装 不同比例 键合强度 

分 类 号：TH706[机械工程—仪器科学与技术]