刚性非共平面的环氧树脂体系的制备及性能研究  

Performance of Curing Epoxy Resins Containing Non-coplanar Rigid Moieties

作　　者：秦静[1,2] 张国平[2] 孙蓉[2] 朱光明[1] 汪正平[3] 

机构地区：[1]深圳大学材料学院,深圳518060 [2]中国科学院深圳先进技术研究院,深圳518055 [3]香港中文大学工程学院,香港999077

出　　处：《高分子学报》2015年第4期390-395,共6页Acta Polymerica Sinica

基　　金：国家自然科学基金(基金号21201175);广东省和深圳创新团队发展计划(项目号2011D052;KYPT20121228160843692);深圳R&D基础研究发展计划(项目号JCYJ20120615140007998);国家科技重大专项(项目号2011ZX02709)资助项目

摘　　要：基于新型的刚性非共平面二胺4',4″-(2,2-diphenylethene-1,1-diyl)dibiphenyl-4-amine(TPEDA)环氧树脂固化剂,采用动态机械分析(DMA)、热机械分析(TMA)和阻抗分析全面研究了其固化环氧树脂(E51)所制备的环氧固化物(E51/TPEDA)的热、机械和介电等综合性能.并与商业化的固化剂2,4-二氨基二苯甲烷(DDM)、4,4二氨基二苯砜(DDS)固化环氧树脂体系进行对比,结果表明由于TPEDA特有的刚性非共平面结构的引入,E51/TPEDA体系表现了较高的玻璃化转变温度、拉伸强度和较低的热膨胀系数、介电常数与损耗等优异物理性能.因此,基于新型非共平面二胺的环氧树脂固化物表现了在电子封装领域的潜在应用前景.A kind of aromatic diamine, 4′, 4″- （2,2-diphenylethene-1,1-diyl） dibiphenyl-4-amine （ TPEDA ） containing nonplanar rigid twisted moieties in the molecular structure was used as curing agent to prepare epoxy resins cured composites with commercial epoxy resins （E51）. Comparing with conventional diamines （4,4′-diaminodiphenylmethane, DDM and 4,4′-diaminodiphenylsulfone, DDS） , the properties of system E51 / TPEDA, such as glass transition temperature, elastic modulus, stress relaxation and creep, thermal expansion, the dielectric constant and dielectric loss,were roundly studied by dynamic mechanic analysis （DMA） , thermal mechanic analysis （TMA） ,impedance analyzer,et al. The results show that the structure of rigid non-specific coplanar diamine TPEDA as epoxy curing agent,can significantly improve the glass transition temperature （258℃ ） , elastic modulus （23.7 MPa） and dimensional stability,while reduce the thermal expansion coefficient of the cured product （ CTE1：61. 9612 × 10 ^-6, CTE2 ： 138. 3265 ×10 ^-6） ,dielectric constant （4.76 at 1 kHz） and the dielectric loss （ 1.93 ×10^-2 at 1 MHz）. When TPEDA which contains a special twisted steric structure is introduced into the epoxy resin main chain, it minimizes the strong interaction and tight stacking of the molecular chains and then increases the free volume of the polymers. Furthermore, the abundant rigid moieties in TPEDA used as curing agent can also improve the thermal stability of epoxy resins. Therefore E51/ TPEDA can be used for high-density integrated circuit device package.

关 键 词：电子封装 环氧树脂 刚性非共平面 固化剂 

分 类 号：O633.13[理学—高分子化学]