波峰焊与回流焊焊接缺陷对比分析  

Defects Contrast between Wave Soldering and Reflow Soldering

作　　者：黄铂[1] 

机构地区：[1]武汉船舶职业技术学院,湖北武汉430050

出　　处：《武汉船舶职业技术学院学报》2015年第2期36-38,共3页Journal of Wuhan Institute of Shipbuilding Technology

摘　　要：分析了波峰焊与回流焊的焊接工艺流程,在此基础上对比了这两种工艺常见缺陷的相同之处与不同之处,并分析了产生这些缺陷的原因。This essay analyzes the welding process of wave soldering and reflow soldering firstly ,then compares the similarities and differences in the common defects of two kinds of processing ,and finally analyzes the causes of these defects .

关 键 词：回流焊 波峰焊 气孔 锡珠 桥接 

分 类 号：TG44[金属学及工艺—焊接]