阳极键合中离子导电聚合物的开发  

Development of Conductive Polymers in Anodic Bonding

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作  者:赵为刚[1] 阴旭[1] 刘翠荣[1] 杜超[1] 

机构地区:[1]太原科技大学材料科学与工程学院,山西太原030024

出  处:《机械管理开发》2015年第3期3-6,18,共5页Mechanical Management and Development

基  金:山西省大学生创新训练计划资助项目(2013240)

摘  要:为了促进阳极键合技术在微机电系统封装环节的使用,开发一种离子导电聚合物代替原有的封装键合材料。设计利用聚氧化乙烯(PEO)作为基体,碱金属锂盐(LiClO4、LiPF6、LiBF4)作为电解质材料,利用高能球磨法对材料混粉进行研磨,使之充分络合,并分析其在不同制备参数下材料导电性的变化。最终利用m(PEO)∶m(LiClO4)为10∶1,在球磨转速为250r/min、球磨时间为8h、球料比为7∶1时,所得材料导电性最佳。将所制备PEO-LiClO4与铝箔进行阳极键合,在键合参数为:预热100℃、预设电压800V、键合时间10min的条件下,键合质量良好,有过度层产生,这也是能键合成功的关键。说明所制备离子导电聚合物PEO-LiClO4满足阳极键合要求。In order to promote the anodic bonding technology in the use of mems encapsulation Iink, develop a ion conductive pol- ymer instead of the original packaging bonding material Design using polyethylene oxide (PEO) as matrix, alkali metal lithium (LiClO4. LiPF6 .LiBF4 ) as the electrolyte material, using the method of high-energy ball mill for grinding material blending, fully complexation, and analyzes the changes of conductivity under different processing parameters. Finally using the PEO and LiClO4 according to the mass ratio of 10: 1, the ball mill speed of 250 r/min, ball grinding time of 8 hours, the ball material ratio of 7: 1, conductivity best. To the preparation of PEO-LiClO4 anodic bonding with aluminum foil, the bonding parameters as: preheat to 100℃, the preset voltage 800 v, 10 min under the conditions of bonding time, bonding quality is good, have excessive layer, which is to bond the key to success. Specifies that the preparation of ionic conductive polymer PEO-LiClO4 satisfies the require- ment of anodic bonding.

关 键 词:MEMS 封装 阳极键合 离子导电聚合物 球磨 制备 

分 类 号:TG456[金属学及工艺—焊接]

 

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