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机构地区:[1]中国电子科技集团公司第十三研究所,河北石家庄050000
出 处:《电镀与涂饰》2015年第13期730-732,共3页Electroplating & Finishing
摘 要:通过镀金层的表面形貌观察和成分测定,分析了陶瓷封装外壳镀金层在350°C空气气氛下高温试验2 h后变色的原因。研究了分别以Ni镀层、Ni–Co合金和Ni/Ni–Co复合镀层作底层时陶瓷封装外壳的抗高温变色能力。结果表明,陶瓷封装外壳变色是由底层镍扩散到镀金层表面形成氧化镍所致。以Ni–Co合金和Ni/Ni–Co复合镀层作底层可有效阻止镍的扩散,从而提高陶瓷封装外壳的抗高温变色能力。The discoloration causes of gold coating on ceramic package surface after high temperature test for 2 h in air were analyzed by observing surface morphology and determining composition of the gold coating. The discoloration resistance of ceramic packages at high temperature using Ni coating, Ni-Co alloy coating, and Ni/Ni-Co composite coating as underlayer respectively were studied. The results showed that the discoloration of ceramic package occurs as a result of nickel diffusion from underlayer to gold coating and formation of nickel oxide on the surface. Using a Ni-Co alloy or Ni/Ni-Co composite coating as underlayer can effectively inhibit the nickel diffusion and improve the discoloration resistance of ceramic at high temperatures.
分 类 号:TQ153.18[化学工程—电化学工业] TQ153.2
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