低温共烧陶瓷共烧焊盘可焊接性研究  

Solderability Research on Co-fired Soldering Pad of Low Temperature Co-fired Ceramic

作　　者：严蓉[1] 戴雷[1] 曹常胜[1] 

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2015年第4期398-402,共5页Research & Progress of SSE

摘　　要：共烧焊盘可焊性是关系LTCC外壳基板能否实际应用的关键因素之一。针对实际产品中出现的不良例,本文进行了相关研究,发现共烧焊盘表面玻璃相是导致焊盘可焊性失效的主要原因,同时分析了玻璃相产生的机理及其影响因素。结合实际生产工艺,降低最高烧结温度可有效消除共烧焊盘表面玻璃相,提高焊盘可焊性。The solderability of co-fired soldering pads is a key factor determining whether LTCC case and substrate can be used or not.Glass phase overlaying on co-fired soldering pads′surface is an important factor leading to the failure based on the analysis of invalid LTCC products in practical application.Mechanism of glass phase forming and its influencing factors are analyzed.According to practical process,glass phase in co-fired soldering pads′surface is removed by lowering the highest co-fired temperature,and solderability of co-fired soldering pads is improved.

关 键 词：低温共烧陶瓷 可焊接性 共烧焊盘 微晶玻璃 

分 类 号：TN45[电子电信—微电子学与固体电子学]