多温度梯度焊接在薄膜混合集成电路中的应用  

Applications of Multi Temperature Gradient Soldering in Thin Film Hybrid Integrated Circuit

作　　者：童洋[1] 周婷[1] 车江波[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2015年第2期42-47,共6页Hybrid Microelectronics Technology

摘　　要：随着薄膜混合集成电路组装密度不断提高，组装器件种类不断增加，单温度焊接已难以满足薄膜混合集成电路高可靠组装的要求。本文研究了多温度梯度焊接工艺在薄膜混合集成电路中的应用。根据产品工艺特点，研究了不同合金配比的焊料与薄膜金属化膜系之间的焊接。研究了不同合金配比焊料在薄膜混合集成电路中的工艺参数。通过试验，论证了多温度梯度焊接工艺在产品质量和效率提升、可返工性、可靠性等等方面的优势。试验表明，多温度梯度焊接能够满足高可靠薄膜混合集成电路产品的要求。With the increase of the density of the hybrid integrated circuit and the increasing of the assembly type of the de- vice, the single temperature soldering is difficult to meet the high reliability assembly requirements of the thin film hybrid integrat- ed circuits. In this paper, the application of multi temperature gradient soldering in thin film hybrid integrated circuit is studied. According to the process characteristic of the circuit, different alloy ratio solders soldering on thin -film metallization system are studied. The process parameters of different alloy composition in the thin film hybrid integrated circuit are studied. The superiority of multi temperature gradient soldering is demonstrated in soldering quality and efficiency improvement, circuit rework, and relia- bility. The test show that multi temperature gradient soldering can meet the requirement of high reliability assembly of thin film hy- brid integrated circuit.

关 键 词：薄膜混合集成电路 组装 焊料 多温度梯度焊接 

分 类 号：TN451[电子电信—微电子学与固体电子学]