MEMS刻蚀工艺仿真模型及研究进展  

Simulation and Research Progress of MEMS Etching Process

作　　者：蒋文涛[1] 方玉明[1] 俞佳佳[1] 王德波[1] 夏晓娟[1] 

机构地区：[1]南京邮电大学电子科学与工程学院,南京210003

出　　处：《微电子学》2015年第5期661-665,共5页Microelectronics

基　　金：江苏省普通高校专业学位研究生科研实践计划(SJLX_0372);江苏省自然科学基金资助项目(BK20131380);江苏省高校自然科学研究面上项目(14KJB510025)

摘　　要：随着计算机技术和微机电系统发展的需要,微加工刻蚀工艺的计算机模拟得到了飞速发展。综述了微加工刻蚀工艺的研究现状以及几种典型的工艺刻蚀仿真方法,分析了各种方法的优势和不足;重点介绍了在基于各向异性刻蚀方面应用广泛的元胞自动机法(CA),分析其优势所在,并阐述了CA模型的基本原理、发展变化和研究应用。With the development of computer technology and MEMS（Micro-Electro-Mechanical System）, the computer simulation of micro machining etching process has been developed rapidly. The research status of the etching process and several kinds of typical simulation technologies about etching process were summarized. The advantages and drawbacks of these simulation technologies were also discussed. The cellular automation （CA） method that widely used in the anisotropic etching simulation was mainly introduced. The advantages of CA compared with other methods were analyzed. The basic principle model, development and research applications of CA were expounded.

关 键 词：MEMS 刻蚀工艺 工艺仿真 元胞自动机 

分 类 号：TN05[电子电信—物理电子学]